Herent® Chimera® M - PLASMA ETCHING - Leuven Instruments -- 系统未授权

Herent^® Chimera^® M

12" METAL ETCHING SYSTEM

Inductively Coupled Plasma Etching (ICP) | Strip

System Features

The Herent^® Chimera^® M metal etching system is intended for volume production of 12" IC wafers
Consists of ICP etch chambers, strip chambers, and a transfer module
For high density aluminum interconnect logic applications and aluminum pad processes starting from 0.18 μm nodes

Overview

The Herent® Chimera® M system is suitable for 12" IC fabs. While designed specifically for back-end-of-line (BEOL) high density aluminum interconnect processes starting from 0.18 μm technology nodes, Herent® Chimera® M also has applications in BEOL aluminum pad processes. This system offers superior uniformity control and cost-effective solutions.