Overview

The Herent^® Chimera^® A system is designed specifically for back-end-of-line (BEOL) TiN metal hardmask opening processes. In 12" IC fabs, the hardmask opening process is repeated multiple times during wafer fabrication, since the high selectivity afforded by metal hardmasks allows feature size to keep shrinking. Herent^® Chimera^® A meets the hardmask etch specification for various technology nodes. Additionally, for LMEC-300™ systems with Chimera^® A hardmask opening chambers, the ability to process both device functioning layers and hardmasks makes them an integrated solution for emerging memory applications.